Please use this identifier to cite or link to this item:
Title: Using Finite Element Method software to enhance teaching about copper pillar bump flip-chip packaging.
Authors: 國立臺灣師範大學科技應用與人力資源發展學系
Guu, Y. H.
Lee, L. S.
Huang, M. Z.
Issue Date: 1-Jan-2011
Publisher: World Institute for Engineering and Technology Education
ISSN: 1446-2257
Other Identifiers: ntnulib_tp_E0202_01_163
Appears in Collections:教師著作

Files in This Item:
There are no files associated with this item.

Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.