Using Finite Element Method software to enhance teaching about copper pillar bump flip-chip packaging.
| dc.contributor | 國立臺灣師範大學科技應用與人力資源發展學系 | zh_tw |
| dc.contributor.author | Guu, Y. H. | en_US |
| dc.contributor.author | Lee, L. S. | en_US |
| dc.contributor.author | Huang, M. Z. | en_US |
| dc.date.accessioned | 2014-10-30T09:34:07Z | |
| dc.date.available | 2014-10-30T09:34:07Z | |
| dc.date.issued | 2011-01-01 | zh_TW |
| dc.description.uri | http://www.wiete.com.au/journals/WTE&TE/Pages/Vol.9,%20No.3%20(2011)/11-Guu.pdf | zh_TW |
| dc.identifier | ntnulib_tp_E0202_01_163 | zh_TW |
| dc.identifier.issn | 1446-2257 | zh_TW |
| dc.identifier.uri | http://rportal.lib.ntnu.edu.tw/handle/20.500.12235/35584 | |
| dc.language | en | zh_TW |
| dc.publisher | World Institute for Engineering and Technology Education | en_US |
| dc.relation | World Transactions on Engineering and Technology Education, 9(3), 178-183. (NSC 100-2511-S-239-002) | en_US |
| dc.rights.uri | http://www.wiete.com.au/ | zh_TW |
| dc.title | Using Finite Element Method software to enhance teaching about copper pillar bump flip-chip packaging. | en_US |