整合數位全像與條紋投影方式應用於積體電路表面量測之研究

Abstract

本研究為整合數位全像術(Digital Holography, DH)與條紋投影輪廓術(Fringe Projection Profilometry, FPP)兩技術於同一系統，透過此整合系統量測物體的三維表面，可達到比單一技術量測結果更加完整的三維表面資訊。如今晶片尺寸越做越小，對z軸解析度的要求越來越高，在量測樣本的深度變化時，DH的三維解析度比FPP更加精密，因此可以透過DH量到更精密的元件；FPP則可以量測漫射面的物體表面資訊，而且在量測階高物體上FPP略勝一籌，可以量測到階高物體的高度，最後整合兩技術之優點，將這兩者技術的量測結果整合，即可獲得高解析度、物體資訊更完整的三維複合表面階高物體結果。

This research is to integrate two technologies of Digital Holography (DH) and Fringe Projection Profilometry (FPP) within the same system. The integrated system, is capable of measuring three-dimensional surface of the object. Utilizing the integrated system i.e. key benefits of DH and FPP results in more complete three-dimensional surface information.Nowadays, the chip size is getting smaller, and the requirements for the z-axis resolution are getting higher. When measuring the depth of the sample, the three-dimensional resolution of DH is better than FPP, so smaller details of the components can be measured through DH. FPP can measure the surface information of the object on the diffuse surface along with precise measurement of the height of the object. In the proposed study, the advantages of DH and FPP are integrated. The FPP is driven to measure the 3D surface of diffuse and step-high objects, the DH is for higher resolution to measure the detail component. During the integrated system can obtain the higher resolution and more complete information of object.