Novel positive-tone thick photoresist for high aspect ratio microsystem technology
| dc.contributor | 國立臺灣師範大學機電工程學系 | zh_tw |
| dc.contributor.author | Hsieh, Gen-Wen | en_US |
| dc.contributor.author | Hsieh, Yu-Sheng | en_US |
| dc.contributor.author | Yang, Chii-Rong | en_US |
| dc.contributor.author | Lee, Yu-Der | en_US |
| dc.date.accessioned | 2014-10-30T09:36:15Z | |
| dc.date.available | 2014-10-30T09:36:15Z | |
| dc.date.issued | 2002-08-01 | zh_TW |
| dc.description.abstract | A methacrylate copolymer combining chemically amplified concept and casting technique was developed as a novel thick photoresist for the UV-LIGA process. Photoresist layers up to 500 μm in thickness can be fabricated easily. Microstructures fabricated by the novel thick photoresist were demonstrated. At present, the ring-shape microstructures with 150 μm tall and 15 μm wide have been realized and the calculated aspect ratio is 10. | en_US |
| dc.description.uri | http://www.springerlink.com/content/kcexffw3v20fuhf5/fulltext.pdf | zh_TW |
| dc.identifier | ntnulib_tp_E0403_01_005 | zh_TW |
| dc.identifier.issn | 0946-7076 | zh_TW |
| dc.identifier.uri | http://rportal.lib.ntnu.edu.tw/handle/20.500.12235/36948 | |
| dc.language | en | zh_TW |
| dc.publisher | Springer Verlag | en_US |
| dc.relation | Microsystem technologies 8(4-5), 326-329. | en_US |
| dc.relation.uri | http://dx.doi.org/10.1007/s00542-001-0158-2 | zh_TW |
| dc.title | Novel positive-tone thick photoresist for high aspect ratio microsystem technology | en_US |