高深寬比光輔助電化學蝕刻技術應用於微光開關之研製

dc.contributor國立臺灣師範大學機電工程學系zh_tw
dc.contributor.author楊啟榮zh_tw
dc.date.accessioned2014-10-30T09:36:23Z
dc.date.available2014-10-30T09:36:23Z
dc.date.issued2004-07-01zh_TW
dc.description.abstract本研究計畫將發展低成本之光輔助電化學蝕刻(ECE)技術,應用於具高深寬比矽微結構之製作,並利用改變光照強度與電流密度等實驗條件,達到微光機電結構之製作,以取代高成本的感應耦合電漿離子蝕刻(ICP-RIE)製程技術。由實驗的結果顯示,本研究已順利自行開發電化學蝕刻高深寬比孔洞所需之設備,並利用此設備得到最佳之製程參數,蝕刻所得結構之深寬比超過70以上,除此之外,並在蝕刻液中添加自行開發之添加劑,使孔洞側壁結構具更佳之粗糙度,其有非常顯著的效果。最後透過蝕刻時間的增加,使孔洞深度加深,使其能夠達到貫穿晶片及符合晶圓級封裝之需求。zh_tw
dc.description.abstractThe project will develop the technology of low-cost photo-assisted electrochemical etching (ECE) for the fabrication of silicon micro- structure with high aspect ratio. The technique will take the place of inductively coupled plasma reactive ion etching (ICP-RIE) process. For the application of micro- opto-electro-mechanical system (MOEMS). The results show we olready set up photo-assisted electro-chemical etching apparatus in this study. we also find optimal process condition with the apparatus and get over 50 aspect micro-structure. Moreover, To use an additive improve the structure roughness. After through-holes etching obtained, a wafer with conductive inter-connection will be bonded with the device wafer finally.en_US
dc.identifierntnulib_tp_E0403_04_010zh_TW
dc.identifier.urihttp://rportal.lib.ntnu.edu.tw/handle/20.500.12235/37037
dc.languagechizh_TW
dc.relation(國科會專題研究計畫,NSC92-2212-E003-002)zh_tw
dc.subject.other光輔助電化學蝕刻zh_tw
dc.subject.other感應耦合電漿離子蝕刻zh_tw
dc.subject.otherphoto-assisted electro-chemical etching(ECE)en_US
dc.subject.otherinductively coupled plasma reactive ion etching (ICP-RIE)en_US
dc.title高深寬比光輔助電化學蝕刻技術應用於微光開關之研製zh_tw
dc.titleDevelopment of Micro-Optical Switch by High-Aspect-Ratio Photo-Assisted Electrochemical Etching Technologyen_US

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