具掌性分子摻雜之高分子材料及元件

Abstract

本研究針對不同Chiral Dopants（R/S-BINAP、R/S-811與R/S-5011）參雜於三種常見高分子材料（PFO、F8BT與F8T2）所形成之手性發光薄膜進行系統性研究，探討其在光致發光（CPL）與電致發光（CPEL）下的掌性行為與機制，並進一步製作元件進行性能評估。透過gabs與glum值的量測與比較，本研究成功篩選出具最佳掌性表現之材料組合，其中F8T2參雜R/S-5011的薄膜在gabs與glum表現上皆為最佳，顯示此材料系統具有極高的掌性誘發潛力。實驗結果亦顯示，不同Chiral Dopant與高分子主體間存在明顯的掌性耦合效應，能有效誘發材料產生旋光特性，並進一步體現在元件之電致圓偏振發光行為上。此外，透過CD與CPL光譜的分析，我們提出掌性誘發可能來自以下幾點機制：一為小分子與高分子鏈間的立體排布與交互作用導致的手性自組裝現象；二為薄膜形貌與膜厚所造成之干涉與旋光耦合效應；三為材料本身的電子結構在退火過程中受到誘導產生非對稱躍遷行為。這些因素交互影響最終導致薄膜與元件在參雜條件下仍保有可觀的掌性發光表現。本研究顯示有機高分子材料在經適當手性小分子摻雜與製程調控後，能展現穩定且明顯的掌性發光特性，未來可應用於多項先進光電元件中，例如：圓偏振OLED顯示器、旋光生物感測平台以及光學加密系統等。後續研究建議可針對材料結構最佳化、掌性訊號強度提升與元件壽命延長等方向深入探討，以利實現實用化與商業化應用。

This study explores the chiroptical properties of luminescent thin films formed by doping chiral molecules (R/S-BINAP, R/S-811, R/S-5011) into conjugated polymers (PFO, F8BT, F8T2). Circularly polarized luminescence (CPL) and electroluminescence (CPEL) were measured to assess chiral performance. Among all combinations, F8T2 doped with R/S-5011 showed the highest gabs and glum values, indicating superior chirality induction. The results reveal strong chiral coupling between dopants and host polymers, with induced optical activity clearly observed in device-level CPEL spectra.Through CD and CPL spectral analysis, we propose that the chirality arises from: (1) stereochemical interactions and self-assembly between small molecules and polymer chains; (2) interference and optical coupling effects due to film morphology and thickness; and (3) asymmetrical electronic transitions induced by thermal annealing. These factors collectively contribute to the robust chiral emission observed under optimized doping conditions.This work highlights the potential of doped polymer systems to generate stable and significant chiral luminescence, providing a foundation for advanced optoelectronic applications such as circularly polarized OLED displays, chiral biosensors, and optical encryption technologies. Future studies may focus on material optimization, enhancement of chiral signal intensity, and improvement of device lifetime to accelerate practical and commercial deployment.