厚度10 μm鑽石輪刀開發與光學玻璃切溝研究

Abstract

本研究旨在開發超薄型電鑄圓盤鑽石輪刀，專用於脆性材料如光學玻璃的開溝加工等所需之微型圓盤刀具。文中使用一種複合式的電鑄技術，利用鑽石微粉與鎳鑄液的均勻混合，進行低成本的超薄型圓盤鑽石切割刀具製作。首先，以鈦金屬製成精密電鑄模具，再以複合電鑄將粒徑0-2μm的鑽石顆粒電著於模具上，以達到圓盤輪刀胚料的製作。電鑄過程中，為使槽體內部的鑄液具有良好的對流性，也提出一種陣列式微孔隔板設計，它能有效降低鑄液的衝擊，減緩鑄液對微粒鑽石的沖襲能量，並提高鑽石的均布率與鎳離子的置換性。於電鑄完成後，利用微放電加工技術，將電鑄完成之圓盤輪刀粗胚修整薄化成型，輪刀厚度可至10μm。經由化學方式的銳化製程，鑽石能迅速裸露並提供足夠的切刃供研削使用。以製作完成的微鑽石輪刀，使用高速快淺研削對光學玻璃進行微細開溝加工。由多次實驗證明，本研究能成功切割出微細溝槽，這項技術將轉換至金屬模具的細溝加工。

The major purpose of the thesis is to develop an approach what fabricating the ultra thin diamond grinding wheel to grind the micro grooves on the hard-brittle material such as the optical glass. An economical composite electroforming that mixes the fine-grain diamonds and nickel sulfa mate solution evenly is employed for making the blank of grinding wheel. The blank of the wheel is fabricated through plating process, the micro diamonds with grain size of 0-2 μm is uniform deposited onto the substrate that made of titanium (Ti) alloy. A partition plate that with an array of drilled holes is designed to ensure good convection in the electroforming solution is proposed. The energy with which the solution impacts the micro substrate is reduced; the diamond grains are uniformly dispersed in the tank and increasing the displacement of nickel ions. The finished wheel blank is thinned with micro EDM process to true and form the micro disk down to the size of 10 μm in thickness. The diamond grains can be emerged from the grinding wheel after etching process so that provides sufficient amounts of cutting edges to grind the micro grooves. A high-speed and fast-shallow grinding technique is utilized for precisely making the micro grooves on the optical glass. Experimental results demonstrate satisfactory grooves’ geometric accuracy, dimensional accuracy and surface roughness. Furthermore, the micro grooves can be fabricated efficiently using the proposed technique.