3D 影像視覺系統SMD元件檢測之應用研究

Abstract

由於印刷電路板組裝業中,所應用之表面黏著技術(SMT)日益成熟,著裝 機之準確度亦不斷提昇,但仍有許多瑕疵存在於製程之中,其中主要包括元件 之缺件、歪斜、極性反、錫膏造成短路等現象。 本研究提出以 5 支CCD(1 TOP,4 Angle),產生高精度資訊,重建錫膏或 PCB 零件3D 表面輪廓。透過機器視覺瑕疵偵測於生產線製程中,發現瑕疵, 則可以容易且經濟找錫膏或PCB 零件的缺陷,避免後製程材料、人力及時間 的浪費。 鑑於不同照明方式會密切影響檢測結果,本研究採用多層式環狀發光二極 體陣列(LED Array),可根據不同取像需求,以程式控制自動切換照明方式, 取得適當之影像,因此本研究利用所開發之演算法,搭配不同照明以決定最適 光源與PCB 自動檢測演算法之組合,並以實作系統來驗證所開發PCB 自動檢 測系統之適用性及有效性。
SMT machine in PCB assembly is moving up rapidly during the past decades.While many defects, such as component missing, misalignment, wrong polarity,solder bridge, etc., still hide in the working process. This paper presents it by 5 CCDs (1 TOP, 4 Angle).To produce high-accuracy information, rebuild the solider paste or 3D surface outline of PCB’s components . Using machine vision to detect on assemble line to find faults ,so it can easy and economy defect solider paste or component on PCB faults. To prevent from wasting of materals 、time and manpower . A new programmable-controlled lighting environment composed of multi-layer of ring-type LED array is also designed, which can provide appropriate light for grabbing the desired PCB image. A prototype of the PCB auto- inspection machine is implementproposed machine vision method. Key word : SMT, three-dimension measurement , PCB

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表面黏著技術, 三維量測, 印刷電路板, SMT, three-dimension measurement, PCB

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