高科技業硬體研發工程師職能評核指標建構之研究

Abstract

本研究旨為探究高科技業之硬體研發工程師主要職責、工作任務、工作產出、行為指標以及其核心職能內涵，以建構高科技業硬體研發工程師職能評核指標及權重。本研究採文獻分析、專家深度訪談、專家驗證問卷、焦點團體座談驗證會議以及層級分析程序法等質化與量化兼重之方法，進行資料蒐集及分析，以建構適用於高科技業硬體研發工程師之職能模型。模型之主要架構包含：主要職責、工作任務、工作產出、行為指標以及核心職能內涵（知識、技能、態度）等面向。研究結果顯示：規劃產品規格、確認產品規格、繪製線路圖與完成Layout佈線、驗證主機板設計規格／除錯、協助客戶產品支援與客戶服務、及導入量產認證為六個主要構面，其中則包含18項職能評核指標。本研究另以層級分析程序法（AHP）調查分析高科技業硬體研發工程師職能評核指標之權重，依序以驗證主機板設計規格／除錯之重要性權重最高、繪製線路圖與完成Layout佈線次之，規劃產品規格排序第三、協助客戶產品支援與客戶服務排序第四、確認產品規格以及導入量產認證為最後；而層級分析方法所獲之重要性排序與硬體研發工程師深度訪談的結果有一致性。根據研究結果，本研究對個案企業提陳未來應用之具體建議。The objective of this study was to establish competency assessment indicators and weights for hardware R&D engineers in high-tech industries. This was achieved by investigation of the job duties, tasks, work output, performance indicators, and core competencies of practitioners in this field. This study adopted qualitative and quantitative approaches to collect and analyze data. These included literature analysis, in-depth interviews with SME (Subject Matter Experts), parcel experts and focus groups. This data was used to construct a competency model comprising the following six constructs: (1) product specification planning, (2) product specification confirmation, (3) circuit diagram drawing and completion of wiring layout, (4) verification and debugging of motherboard design specifications, (5) assistance in customer support and customer service, and (6) mass production certification. These constructs were further divided into eighteen competence assessment indicators. The researcher then used AHP (Analytic Hierarchy Process) to derive the weights of six constructs. Based on the results, suggestions and recommendations are made to facilitate improvement in the practice of hardware R&D engineers.