Novel positive-tone thick photoresist for high aspect ratio microsystem technology
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Date
2002-08-01
Authors
Hsieh, Gen-Wen
Hsieh, Yu-Sheng
Yang, Chii-Rong
Lee, Yu-Der
Journal Title
Journal ISSN
Volume Title
Publisher
Springer Verlag
Abstract
A methacrylate copolymer combining chemically amplified concept and casting technique was developed as a novel thick photoresist for the UV-LIGA process. Photoresist layers up to 500 μm in thickness can be fabricated easily. Microstructures fabricated by the novel thick photoresist were demonstrated. At present, the ring-shape microstructures with 150 μm tall and 15 μm wide have been realized and the calculated aspect ratio is 10.