國立臺灣師範大學機電工程學系Hsieh, Gen-WenHsieh, Yu-ShengYang, Chii-RongLee, Yu-Der2014-10-302014-10-302002-08-010946-7076http://rportal.lib.ntnu.edu.tw/handle/20.500.12235/36948A methacrylate copolymer combining chemically amplified concept and casting technique was developed as a novel thick photoresist for the UV-LIGA process. Photoresist layers up to 500 μm in thickness can be fabricated easily. Microstructures fabricated by the novel thick photoresist were demonstrated. At present, the ring-shape microstructures with 150 μm tall and 15 μm wide have been realized and the calculated aspect ratio is 10.