Using Finite Element Method software to enhance teaching about copper pillar bump flip-chip packaging.

國立臺灣師範大學科技應用與人力資源發展學系Guu, Y. H.Lee, L. S.Huang, M. Z.2014-10-302014-10-302011-01-011446-2257http://rportal.lib.ntnu.edu.tw/handle/20.500.12235/35584Using Finite Element Method software to enhance teaching about copper pillar bump flip-chip packaging.