高頻振動輔助微線切割放電加工技術開發與高密度超高細長比精微陣列探針製作研究
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2013
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精微線切割放電加工(Micro w-EDM)適用於高深寬比(High-aspect-ratio)微細元件的切割加工，尤以具高密度且高細長比的精微陣列式探針(High-spatial-density, high-aspect-ratio micro probe array)最為適合；但線切割放電加工過程中，放電殘渣(Discharge debris)易殘留於工件與細線電極間，導致二次放電(Secondary discharge)甚至短路(Short)發生，影響加工效率。鑒此，本研究發展一套具「精微線切割放電加工機能」的桌上型CNC工具機(Tabletop micro CNC w-EDM machine)，並提出以高頻振動(High-frequency vibration)輔助精微線切割放電加工的方法，即建構壓電陶瓷材料(Piezoelectric ceramic material)於銅線川流的路徑上，用以對微細銅線進行高頻振動輔助，目的在幫助放電殘渣(Discharge debris)排除，以減少二次放電與短路機會。研究證實，本實驗所提原創技術，能加工出10×10陣列，尺寸23×23×2,500μm的高密度且具超高細長比的精微陣列式探針，其細長比超過100:1，非常適用於具高深寬比的微細結構，如3D-IC電路之檢測。而以高頻振動輔助進行切割加工，其所耗時間約是未開啟振動輔助加工所耗時間的75-80%，直線精度亦不因振動輔助而受影響，證實高頻振動輔助能有效提高線切割放電加工的效能，成功實現高速度高精度的精微線切割放電加工法，此項研究成果，深具商用價值。
Micro w-EDM (wire Electrical Discharge Machining) is highly suitable for machining of high-aspect-ratio micro components. However, there is a difficulty in the removal of debris during the machining resulting in secondary discharge even short happening easily in the micro gap. A micro w-EDM technique specifically for machining high-spatial-density and ultra-high-aspect-ratio micro structures is developed in this thesis. A tabletop CNC machine equipped with a complete micro w-EDM system for wire tension (20µm in diameter) control is designed and employed for the study of ultra-high-aspect-ratio micro probe array fabrication. A high-frequency vibration assisted technique that the micro wire is vibrated radially with micro scale via a piezoelectric ceramic material is proposed to assist in the removal of debris and reduce the frequencies of secondary discharge and short. Experimental results demonstrate that the proposed approach can fabricate high-spatial-density and ultra-high-aspect-ratio micro structure with 10x10 squared probes. The finished probe array thathave the dimensions of 23×23×2,500μm and the aspect ratio of over 100 is qualified to detect the micro structural circuit, 3D-IC especially. In addition, the time is about four-fifth of the machining time for without high-frequency vibration assisted. The machining efficiency is greatly improved and achieve a high -speed and -accuracy micro w-EDM approach. These experimental results will be of substantial benefit to precision machining.
Micro w-EDM (wire Electrical Discharge Machining) is highly suitable for machining of high-aspect-ratio micro components. However, there is a difficulty in the removal of debris during the machining resulting in secondary discharge even short happening easily in the micro gap. A micro w-EDM technique specifically for machining high-spatial-density and ultra-high-aspect-ratio micro structures is developed in this thesis. A tabletop CNC machine equipped with a complete micro w-EDM system for wire tension (20µm in diameter) control is designed and employed for the study of ultra-high-aspect-ratio micro probe array fabrication. A high-frequency vibration assisted technique that the micro wire is vibrated radially with micro scale via a piezoelectric ceramic material is proposed to assist in the removal of debris and reduce the frequencies of secondary discharge and short. Experimental results demonstrate that the proposed approach can fabricate high-spatial-density and ultra-high-aspect-ratio micro structure with 10x10 squared probes. The finished probe array thathave the dimensions of 23×23×2,500μm and the aspect ratio of over 100 is qualified to detect the micro structural circuit, 3D-IC especially. In addition, the time is about four-fifth of the machining time for without high-frequency vibration assisted. The machining efficiency is greatly improved and achieve a high -speed and -accuracy micro w-EDM approach. These experimental results will be of substantial benefit to precision machining.
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精微線切割放電加工, 高密度及超高細長比精微陣列式探針, 高頻振動, micro w-EDM, High-spatial-density and ultra-high-aspect-ratio micro probe array, high-frequency vibration