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Title: Novel positive-tone thick photoresist for high aspect ratio microsystem technology
Authors: 國立臺灣師範大學機電工程學系
Hsieh, Gen-Wen
Hsieh, Yu-Sheng
Yang, Chii-Rong
Lee, Yu-Der
Issue Date: 1-Aug-2002
Publisher: Springer Verlag
Abstract: A methacrylate copolymer combining chemically amplified concept and casting technique was developed as a novel thick photoresist for the UV-LIGA process. Photoresist layers up to 500 μm in thickness can be fabricated easily. Microstructures fabricated by the novel thick photoresist were demonstrated. At present, the ring-shape microstructures with 150 μm tall and 15 μm wide have been realized and the calculated aspect ratio is 10.
ISSN: 0946-7076
Other Identifiers: ntnulib_tp_E0403_01_005
Appears in Collections:教師著作

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